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Why is automatic glue coating line used in packaging boxes for electronic components
source：www.ppplus.cn | Release time：2025年06月25日1、 The special nature of electronic components drives the demand for automated adhesive coating
1. High precision protection requirements
Anti static and dust-proof requirements:
Chips, PCB boards, and other electronic components are sensitive to static electricity (static voltage ≥ 200V can damage ICs), and packaging boxes need to be sealed and dust-proof by applying glue to prevent dust particles (≥ 5 μ m) from entering. The automatic glue line can correctly control the position of the glue line (such as applying glue along the edge of the box cover by 0.3mm), forming a continuous sealing ring with a dustproof level of IP54.
Seismic buffering requirements:
Precision components such as MEMS sensors and camera modules need to be fixed with cushioning materials (such as EVA foam) inside the packaging box. Manual glue application can easily result in uneven glue volume and foam displacement. The automatic glue application line ensures a firm fit of the cushioning layer through glue positioning (glue point spacing ± 0.5mm).
2. Complexity of materials and craftsmanship
Multiple material bonding challenges:
Electronic component packaging boxes often contain composite materials such as anti-static vacuum forming (PET-G), conductive sponge, and metal shielding layer. The surface energy of different materials varies greatly (such as PET surface energy of 38 dyn/cm, metal foil of 72 dyn/cm). The automatic glue line can switch the glue type according to the material (such as polyurethane glue for PET and epoxy glue for metal), and the adhesion is improved through a preheating device (temperature control ± 5 ℃).
Micro coating adhesive demand:
The size of the small component packaging box (such as the carrier box for 0402 packaged resistors) is only 10cm × 5cm, and the accuracy of the glue coating trajectory needs to be ≤ 0.1mm, which cannot be met manually. The automatic glue coating line is equipped with a micro spray valve (glue output of 0.005 μ L), which can complete continuous glue coating in a 0.5mm wide groove.
2、 The technological advantages and production value of automatic glue coating line
1. Efficiency and Capacity Enhancement
High speed mass production:
The efficiency of manual gluing is about 5-8 boxes/minute, and it is prone to quality fluctuations due to fatigue; The automatic glue coating line comes standard with a servo conveyor belt (speed 20m/min), which is used in conjunction with multi station parallel operations (such as glue coating detection curing synchronization). The single machine production capacity can reach 20-30 boxes/minute, and the daily production capacity for 24-hour continuous production exceeds 30000 boxes. It is suitable for large-scale shipment of electronic components (such as the packaging requirements of chip factories for monthly production of one million pieces).
Quick response for changeover:
The iteration of electronic component models is frequent (such as annual updates for mobile phone chips), and the automatic glue line can preset glue parameters for different packaging boxes through the program (such as glue line trajectory, glue amount, speed). The changeover time is ≤ 3 minutes, which is 10 times more efficient than manual debugging.
2. Quality stability and yield guarantee
Precision control reduces defects:
Glue amount error ≤± 1%: Accurately measure with a screw pump (such as an error of 0.1g glue amount ≤ 0.001g) to avoid excessive overflow of glue contaminating components, or insufficient glue causing weak adhesion.
Position accuracy ± 0.05mm: With the help of a visual recognition system (CCD camera to identify the positioning hole of the box body), the deviation between the glue coating trajectory and the design drawing is less than 0.1mm. For example, correctly applying glue in the sealing groove of the PCB anti-static box ensures that there is no gap after the cover is closed.
Automated detection closed-loop:
The automatic glue line integrates a laser thickness gauge and AI visual inspection, which scans the thickness (error ≤± 0.02mm) and integrity of the glue layer in real time. When glue leakage or breakage is found, it is automatically marked and removed. The defect rate can be controlled below 0.3%, far lower than the 5% defect rate of manual glue application.
3、 Typical application scenarios and process details
1. Sealing and gluing of chip carrier box
Scenario: The anti-static carrier box (size 30cm × 20cm) for QFP packaged chips is covered and coated with adhesive.
Process requirement: Apply 1mm wide hot melt adhesive (melting point 70 ℃) along the edge of the box cover to form a closed adhesive ring to prevent dust from entering during transportation.
Automatic line scheme:
The preheating device heats the box body to 40 ℃ to enhance the wetting properties of the adhesive;
The hot melt glue machine applies glue along the edge at a speed of 0.5mm/s, and with the help of a cooling fan, the glue layer solidifies within 10 seconds to avoid thermal damage to the chip.
2. Fixation of PCB turnover box lining
Scenario: The EVA foam lining of the anti-static turnover box for PCB boards (size 50cm × 40cm) is bonded.
Process challenge: Foam is prone to deformation, and uneven glue application during manual gluing can cause local protrusions in the foam, squeezing the solder joints on the PCB board.
Automatic line scheme:
Using "matrix dispensing" (dispensing spacing 5cm × 5cm), with each dispensing point weighing 0.3g, to ensure even force distribution on the foam;
Equipped with a pressure sensor, the foam will automatically press down for 3 seconds after gluing to ensure a firm and deformation free bond.
4、 Cost and compliance advantages
1. Long term cost optimization
Labor cost savings: An automatic glue coating line (with an investment of about 150000 yuan) can replace 8-10 workers (with a monthly salary of 6000 yuan), and the cost can be recovered in 1.5-2 years without the training cost caused by personnel turnover.
Reduced glue loss: The glue utilization rate of the automatic glue coating line reaches 95% (the loss rate of manual glue coating is about 20%). Calculated based on an annual output of 1 million boxes, the annual cost savings of glue are about 120000 yuan.
2. Compliance and standardized production
Environmental and safety certification: The adhesive used in the automatic glue line must comply with RoHS (Restriction of Hazardous Substances such as Lead and Mercury) and REACH (Chemical Registration) standards, and the equipment must be equipped with exhaust gas treatment devices (VOC emissions ≤ 10mg/m 3) to meet the environmental requirements of the electronics industry.
Traceability and quality control: The adhesive parameters (such as time, temperature, and adhesive amount) are automatically recorded in the MES system, supporting batch traceability and meeting the traceability requirements of the ISO9001 quality management system for the production process.
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